WAFER GRINDING APPARATUS

PROBLEM TO BE SOLVED: To provide a wafer grinding apparatus to reduce the use of an abrasive agent. SOLUTION: An abrasive agent 10 is fed from an abrasive agent nozzle 9, an abrasive agent inlet 7 connected to an abrasive agent introducing line 6 is opened in a lower surface side of a wafer holding...

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Bibliographic Details
Main Author OKIMURA HITOSHI
Format Patent
LanguageEnglish
Published 22.05.2001
Edition7
Subjects
BASIC ELECTRIC ELEMENTS
DRESSING OR CONDITIONING OF ABRADING SURFACES
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
GRINDING
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
PERFORMING OPERATIONS
POLISHING
SEMICONDUCTOR DEVICES
TRANSPORTING
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Summary:PROBLEM TO BE SOLVED: To provide a wafer grinding apparatus to reduce the use of an abrasive agent. SOLUTION: An abrasive agent 10 is fed from an abrasive agent nozzle 9, an abrasive agent inlet 7 connected to an abrasive agent introducing line 6 is opened in a lower surface side of a wafer holding ring 4, and the abrasive agent 10 is positively fed into a gap formed between an elastically deformed abrasive pad 2 and a wafer holding ring 4 from the abrasive agent inlet 7. As a turn table 1 is rotated, the abrasive pad 2 is allowed to grasp the abrasive agent 10 of sufficient amount, and to efficiently introduce the abrasive agent to a face side of a wafer.
Bibliography:Application Number: JP19990329651