CONNECTOR MATERIAL FOR ELECTRONIC AND ELECTRICAL APPARATUS COMPOSED OF HIGH STRENGTH COPPER ALLOY EXCELLENT IN ROLLABILITY AND BENDING WORKABILITY

PROBLEM TO BE SOLVED: To produce a lead frame material for a semiconductor system capable of the economical thinning of sheet thickness and strong bending working. SOLUTION: This lead frame material for a semiconductor system is composed of a high strength Cu alloy having a composition containing, b...

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Bibliographic Details
Main Authors UTSUGI TAKESHI, IWAMURA TAKURO, CHIBA SHUNICHI
Format Patent
LanguageEnglish
Published 15.05.2001
Edition7
Subjects
ALLOYS
CHEMISTRY
FERROUS OR NON-FERROUS ALLOYS
METALLURGY
TREATMENT OF ALLOYS OR NON-FERROUS METALS
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Summary:PROBLEM TO BE SOLVED: To produce a lead frame material for a semiconductor system capable of the economical thinning of sheet thickness and strong bending working. SOLUTION: This lead frame material for a semiconductor system is composed of a high strength Cu alloy having a composition containing, by weight, 0.07 to 0.4% Cr, 0.01 to 0.15% Zr, 0.01 to 0.4% Ti, 0.01 to 1% Co and/or Fe, 0.002 to 0.4% Al, and the balance Cu with inevitable impurities and excellent in rollability and bending workability.
Bibliography:Application Number: JP19990313511