CURABLE COMPOSITION

PROBLEM TO BE SOLVED: To provide a curable composition for an etching resist giving a cured film excellent in etching resistance, alkali solubility and pealable property, pattern forming property, etc., even in secondary etching at high temperature. SOLUTION: The curable composition contains (a) a c...

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Bibliographic Details
Main Authors MIZUTANI KUNIHIKO, IGARASHI ICHIRO
Format Patent
LanguageEnglish
Published 11.05.2001
Edition7
Subjects
APPARATUS SPECIALLY ADAPTED THEREFOR
BASIC ELECTRIC ELEMENTS
CINEMATOGRAPHY
ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
ELECTRICITY
ELECTROGRAPHY
HOLOGRAPHY
MATERIALS THEREFOR
ORIGINALS THEREFOR
PHOTOGRAPHY
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES
PHYSICS
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Summary:PROBLEM TO BE SOLVED: To provide a curable composition for an etching resist giving a cured film excellent in etching resistance, alkali solubility and pealable property, pattern forming property, etc., even in secondary etching at high temperature. SOLUTION: The curable composition contains (a) a compound having one carboxyl group and one (meth)acryloyl group in one molecule and (b) the di(meth)acrylate of a dihydric alcohol having hydroxyl groups at both ends of a 9-12C alkylene group as principal constituent components with the exception of the tri(meth)acrylate of an alkylene oxide adduct of isocyanuric acid.
Bibliography:Application Number: JP19990302618