HEAT DISSIPATING SPACER

PROBLEM TO BE SOLVED: To provide a heat dissipating spacer with more advanced heat conductivity and restoration performance. SOLUTION: The heat dissipating space is made of a silicone curing substance containing an inorganic filler, where the content of the inorganic filler is 40-80 vol.%, and the v...

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Bibliographic Details
Main Authors KAWASAKI TAKU, OTSUKA TETSUMI
Format Patent
LanguageEnglish
Published 20.04.2001
Edition7
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PROBLEM TO BE SOLVED: To provide a heat dissipating spacer with more advanced heat conductivity and restoration performance. SOLUTION: The heat dissipating space is made of a silicone curing substance containing an inorganic filler, where the content of the inorganic filler is 40-80 vol.%, and the volume ratio of boric acid salt powder of magnesium and/or calcium covered with silica powder/hexagonal boron nitride with an average particle diameter of 10-100 μm ranges from 1:0.5 to 1:1.2.
Bibliography:Application Number: JP19990290576