CHIP TRAY FOR THERMOELECTRIC ELEMENT

PROBLEM TO BE SOLVED: To provide a chip tray wherein the handleability of a thermoelectric element chip is improved by limiting the degree of freedom in moving direction of the chip while inspection of electric characteristics is allowed is housed condition. SOLUTION: The chip tray 10 is formed of a...

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Bibliographic Details
Main Authors OZAWA TATSUHIRO, NISHIMURA SEIYA
Format Patent
LanguageEnglish
Published 20.04.2001
Edition7
Subjects
ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR
BASIC ELECTRIC ELEMENTS
CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS,e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES,DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS
CONVEYING
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
HANDLING THIN OR FILAMENTARY MATERIAL
PACKAGES
PACKAGING ELEMENTS
PACKING
PERFORMING OPERATIONS
SEMICONDUCTOR DEVICES
STORING
TRANSPORTING
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Summary:PROBLEM TO BE SOLVED: To provide a chip tray wherein the handleability of a thermoelectric element chip is improved by limiting the degree of freedom in moving direction of the chip while inspection of electric characteristics is allowed is housed condition. SOLUTION: The chip tray 10 is formed of a synthetic resin excellent in insulation such as ABS resin, fluororesin, polypropylene, or polycarbonate by injection molding by using a mold. A main body part 11 and housing parts 12 arrayed in matrix with specified intervals within the main body part 11 are provided. Each housing part 12 is provided with bottom parts 13 and 13 of V-shaped recesses which are recessed toward a lower surface from an upper surface of the main body part 11, and a pair of side walls 14 and 14 which partition the housing parts 12 adjoining in length direction.
Bibliography:Application Number: JP19990291966