MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE AND APPARATUS THEREFOR

PROBLEM TO BE SOLVED: To improve manufacturing yield and productivity of a semiconductor device by realizing a high-speed scrubbing operation and removing contaminants, oxide films, etc., on the bonding surface for a short time. SOLUTION: This semiconductor device is manufactured such that, when a c...

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Bibliographic Details
Main Authors SUEMATSU MUTSUMI, OTANI KAZUMI
Format Patent
LanguageEnglish
Published 30.03.2001
Edition7
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PROBLEM TO BE SOLVED: To improve manufacturing yield and productivity of a semiconductor device by realizing a high-speed scrubbing operation and removing contaminants, oxide films, etc., on the bonding surface for a short time. SOLUTION: This semiconductor device is manufactured such that, when a capillary 5 is lowered to make a ball 23 contact an electrode pad 8 or inner lead 9, a switching connector 22 connects an oscillator 21 to a speed controller of a servo control system 100 so as to make this system 100 unstable to cause an X-Y table 1 to oscillate finely, thereby causing the capillary 5 to scrub.
Bibliography:Application Number: JP19990257282