ELECTRONIC COMPONENT

PROBLEM TO BE SOLVED: To provide an electronic component having a Pb-free low melting point brazing metal layer used in place of Sn-Pb eutectic solder. SOLUTION: This electronic component has Pb-free high melting point brazing metal layers 4, 4 in the exposed part of a metal outer ring 1 of a gastig...

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Bibliographic Details
Main Authors MORIKAWA TETSUSHI, MAEKAWA HIROSHI, OKUNO AKIRA
Format Patent
LanguageEnglish
Published 16.03.2001
Edition7
Subjects
BASIC ELECTRIC ELEMENTS
BASIC ELECTRONIC CIRCUITRY
CLADDING OR PLATING BY SOLDERING OR WELDING
CURRENT COLLECTORS
CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING
ELECTRICITY
IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS
LINE CONNECTORS
MACHINE TOOLS
METAL-WORKING NOT OTHERWISE PROVIDED FOR
PERFORMING OPERATIONS
RESONATORS
SOLDERING OR UNSOLDERING
TRANSPORTING
WELDING
WORKING BY LASER BEAM
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Summary:PROBLEM TO BE SOLVED: To provide an electronic component having a Pb-free low melting point brazing metal layer used in place of Sn-Pb eutectic solder. SOLUTION: This electronic component has Pb-free high melting point brazing metal layers 4, 4 in the exposed part of a metal outer ring 1 of a gastight terminal A and on the inner side of leads 3, 3, and low melting point brazing metal layers 5, 5 selected from the group of an Sn-Ag base alloy and an Sn-Bi base alloy formed by plating on at least the surface on the outer side of the leads 3, 3.
Bibliography:Application Number: JP19990237069