POSITIVE PHOTOSENSITIVE RESIN PRECURSOR COMPOSITION

• Main Authors: TOMIKAWA MASAO, SUWA MITSUFUMI, FUJITA YOJI
• Format: Patent
• Language: English
• Published: 13.03.2001
• Edition: 7
• Subjects: APPARATUS SPECIALLY ADAPTED THEREFOR; BASIC ELECTRIC ELEMENTS; CHEMISTRY; CINEMATOGRAPHY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; ELECTROGRAPHY; HOLOGRAPHY; MATERIALS THEREFOR; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; ORIGINALS THEREFOR; PHOTOGRAPHY; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES; PHYSICS; SEMICONDUCTOR DEVICES; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS

PROBLEM TO BE SOLVED: To provide a compsn. giving little film loss of non-exposed part during development, capable of developing in a short time, and having less contraction after curing, by incorporating a polymer mainly comprising a polyamic acid having a hydroxyl group, a compd. having a phenolic hydroxyl group, and an esterified quinone diazide compd. SOLUTION: This composition includes (A) a polymer represented by formula I (wherein R1 is a >=2C, di- to octa-valent org. group, R2 is a >=2C, di- to hexa- valent org. group, R3 is H, or a 1-20C org. group, (n) is 10-100,000, (m) is 0-2, and (p) and (q) are each 0-4). (B) a compd. having a phenolic hydroxyl group is represented by formula II (wherein R4, R5, R7, and R8 are each H, a 1-4C alkyl, an alkoxy, or the like R6 is H, hydroxyl group or the like and α, β, γand δ are each 0-3). (C) naphthoquione diazide compd and having molecular weight of preferably 300-1,500. Compounding ratio is 1-50 pts.wt. component B and 1-50 pts.wt. component C based on 100 pts.wt. component A.