LAMINATED SUBSTRATE AND MANUFACTURE THEREOF

PROBLEM TO BE SOLVED: To allow as sharp and smooth carrier concentration profile with no drop in a transition region from an N+ silicon water to an N- silicon wafer. SOLUTION: An N- silicon wafer is laminated on the surface of an N+ silicon wafer. An even and high-resistance N- layer con be manufact...

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Bibliographic Details
Main Authors TOMIZAWA KENJI, KOMATSU KEI, FUNADA TAKESHI, HAYAKAWA JUNICHI
Format Patent
LanguageEnglish
Published 23.02.2001
Edition7
Subjects
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