SEMICONDUCTOR DEVICE

• Main Author: TOYOSHIMA TSUTOMU
• Format: Patent
• Language: English
• Published: 16.02.2001
• Edition: 7
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To prevent the leakage of electromagnetic noise emanated from a semiconductor element, etc., to the outside of a semiconductor device by covering the semiconductor element and its periphery with shielding members made of a conductive material. SOLUTION: An annular ground pattern 14 is formed so as to surround the periphery of a rectangular semiconductor element 7a mounted over the surface of a substrate. Respectively opposing sides of the pattern 14 are coupled by shielding members 15 of metallic wires made of a conductive material in a lattice form to cover the element 7a. The members 15 play the role of a shield for preventing the leakage of electromagnetic noise. Additionally, due to their connection with the pattern 14, the members 15 let noise captured to thereby escape to the pattern 14. Furthermore, the members 15 can dissipate satisfactorily the heat produced by the element 7a to the substrate, since this contributes to improving the heat radiation of the semiconductor device.