MANUFACTURE FOR LAMINATED CHIP ELECTRONIC COMPONENT

PROBLEM TO BE SOLVED: To perform a CIP processing by entering a temporary laminate into an elastic body type, restricting the deformation of the laminate to a minimum, improve process yield, and enhance quality of products. SOLUTION: There is provided an insertion recess part 33 for entering of a te...

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Bibliographic Details
Main Authors UCHIKOBA FUMIO, ANPO TOSHIYUKI
Format Patent
LanguageEnglish
Published 26.01.2001
Edition7
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRICITY
INDUCTANCES
MAGNETS
SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
TRANSFORMERS
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Summary:PROBLEM TO BE SOLVED: To perform a CIP processing by entering a temporary laminate into an elastic body type, restricting the deformation of the laminate to a minimum, improve process yield, and enhance quality of products. SOLUTION: There is provided an insertion recess part 33 for entering of a temporary laminate 20 for temporarily laminating a ceramic green sheet after conductor pattern printing, and an opening dimension of this recess 33 is in matching with or is greater than the planar profile of the temporary laminate 20, and a rubber type 30 is used as an elastic body type, in which a sidewall face 33a of the recess 33 is vertical to a bottom face, and has a height greater than or equal to the thickness of the temporary laminate 20. Furthermore, the temporary laminate 20 is disposed in the recess 33, and is pressurized by a CIP processor 50, so that the temporary laminate 20 is laminated and compressed.
Bibliography:Application Number: JP19990197805