METHOD FOR LOCALLY MELTING SOLDERING AND DEVICE THEREFOR

• Main Author: NAKAI TOMOYUKI
• Format: Patent
• Language: English
• Published: 19.01.2001
• Edition: 7
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MACHINE TOOLS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; PERFORMING OPERATIONS; PRINTED CIRCUITS; SOLDERING OR UNSOLDERING; TRANSPORTING; WELDING; WORKING BY LASER BEAM

PROBLEM TO BE SOLVED: To provide a method for local melting soldering and a device therefor to solder a DIP part, a connector, etc., to a substrate, by which a soldering bridge can be eliminated surely and an appropriate soldering be applied. SOLUTION: A locally melting soldering device 10 is provided with a soldering tank 11 which is filled with a melted solder H, a heater for heating the soldering tank 11, and a transfer mechanism for the melted soldering, the soldering tank 11 is provided with a multi-nozzle plate 20 provided with a number of discharge nozzles 21 corresponding to soldering spots on its upper opening, by which a substrate 30 is soldered. Soldering is applied every spot, so that a soldering bridge can be eliminated and the substrate 30 is kept in an appropriate heating condition, and due to a degassing groove 22 provided on the multi- nozzle plate 20, a gas can be dissipated efficiently and highly accurate soldering be realized.