METHOD FOR LOCALLY MELTING SOLDERING AND DEVICE THEREFOR

PROBLEM TO BE SOLVED: To provide a method for local melting soldering and a device therefor to solder a DIP part, a connector, etc., to a substrate, by which a soldering bridge can be eliminated surely and an appropriate soldering be applied. SOLUTION: A locally melting soldering device 10 is provid...

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Bibliographic Details
Main Author NAKAI TOMOYUKI
Format Patent
LanguageEnglish
Published 19.01.2001
Edition7
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CLADDING OR PLATING BY SOLDERING OR WELDING
CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MACHINE TOOLS
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
METAL-WORKING NOT OTHERWISE PROVIDED FOR
PERFORMING OPERATIONS
PRINTED CIRCUITS
SOLDERING OR UNSOLDERING
TRANSPORTING
WELDING
WORKING BY LASER BEAM
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Summary:PROBLEM TO BE SOLVED: To provide a method for local melting soldering and a device therefor to solder a DIP part, a connector, etc., to a substrate, by which a soldering bridge can be eliminated surely and an appropriate soldering be applied. SOLUTION: A locally melting soldering device 10 is provided with a soldering tank 11 which is filled with a melted solder H, a heater for heating the soldering tank 11, and a transfer mechanism for the melted soldering, the soldering tank 11 is provided with a multi-nozzle plate 20 provided with a number of discharge nozzles 21 corresponding to soldering spots on its upper opening, by which a substrate 30 is soldered. Soldering is applied every spot, so that a soldering bridge can be eliminated and the substrate 30 is kept in an appropriate heating condition, and due to a degassing groove 22 provided on the multi- nozzle plate 20, a gas can be dissipated efficiently and highly accurate soldering be realized.
Bibliography:Application Number: JP19990186374