CONNECTING STRUCTURE OF LARGE-POWER AND HIGH FREQUENCY TRANSMISSION LINE

PROBLEM TO BE SOLVED: To reduce the temperature rise of a connecting part through heat radiation by connecting the central conductor of a coaxial connector in a metallic housing with the conductor line of a flat circuit on a heat conducting dielectric substrate. SOLUTION: After connecting a micro st...

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Bibliographic Details
Main Author YABE NORIO
Format Patent
LanguageEnglish
Published 15.12.2000
Edition7
Subjects
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Summary:PROBLEM TO BE SOLVED: To reduce the temperature rise of a connecting part through heat radiation by connecting the central conductor of a coaxial connector in a metallic housing with the conductor line of a flat circuit on a heat conducting dielectric substrate. SOLUTION: After connecting a micro strip line 15 with a micro strip pattern 54 with a Au connecting ribbon 59, they are connected with the opposite coaxial plug connector. Heat obtained by connecting the central conductor, which is generated by the transmission of a large-power and high-frequency signal sent from the internal circuit of a metallic housing 25, is conducted to a ceramic dielectric plate 52 being the heat conductive conductor of high heat conductivity via a heat conductive bar conductor 57 from the central conductor 35 of a coaxial connector 27 and a pattern 54, passes through a metallic substrate 55 of similarly high heat conductivity and is transmitted to the housing 25 of a large heat capacity by diffusion and is radiated from the surface. Thus the heat of central conductors connected to the connector 27 is dissipated. A proper heat radiating means or cooling means is added to the housing 25 if necessary.
Bibliography:Application Number: JP19990154070