RESIN SEALING METHOD AND RESIN SEALING DEVICE

• Main Authors: ODAJIMA SADATAKA, YAMAMOTO SHOJI, KUNO KOUKI, OKAMOTO HIROTAKA
• Format: Patent
• Language: English
• Published: 15.12.2000
• Edition: 7
• Subjects: AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING; BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; PERFORMING OPERATIONS; SEMICONDUCTOR DEVICES; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR; SHAPING OR JOINING OF PLASTICS; TRANSPORTING; WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

PROBLEM TO BE SOLVED: To prevent an unsatisfactory appearance caused by the blushing of liquid-like resin adhered to the upper surface of a semiconductor chip when filled with resin and hardened in the gap between the semiconductor chip and a substrate. SOLUTION: An exposed part 7, where a substrate 3 is exposed, is provided on the circumference of a semiconductor chip 1, liquid resin 6 is applied there, the atmosphere around the substrate 3 is decompressed, the air of the gap 8 between the semiconductor chip 1 and the substrate 3 is discharged as the exhaust air passing on the exposed part 7, the resin 6, whose viscosity is lowered, is brought into contact with the side face of the semiconductor chip 1 and it is filled into the gap 8 in this resin sealing method. As a result, the resin 6 is filled into the gap 8 leaving a decompressed closed space 10. Then, the atmosphere around the substrate 3 is compressed, the closed space 10 is quenched by compressing from its circumference, and the resin 6 is hardened by heating. Accordingly, as the air of the gap 8 can be exhausted stably from the whole external circumference, the generation of resin blushing, which is blown away to the upper surface of the semiconductor chip 1, can be prevented.