IC COOLER

PROBLEM TO BE SOLVED: To efficiently cool an IC by reducing constitutive members required for heat radiation to restrain generation of stress and deflection. SOLUTION: This IC cooler is composed of an IC 1, a heat transfer strut 2, a fixing spacer 3, a spring 4, a cooling block 6, cooling pipes 7 an...

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Bibliographic Details
Main Author TABATA FUMIO
Format Patent
LanguageEnglish
Published 08.12.2000
Edition7
Subjects
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
MEASURING
MEASURING ELECTRIC VARIABLES
MEASURING MAGNETIC VARIABLES
PHYSICS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
TESTING
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Summary:PROBLEM TO BE SOLVED: To efficiently cool an IC by reducing constitutive members required for heat radiation to restrain generation of stress and deflection. SOLUTION: This IC cooler is composed of an IC 1, a heat transfer strut 2, a fixing spacer 3, a spring 4, a cooling block 6, cooling pipes 7 and screws 24. A heat-conductive material 5a is applied on a package part 1a in an upper face of the IC 1, and a heat-conductive material 5b is applied also onto a contact face contacting with the strut 2 in an insertion hole 6a for the strut 2 provided in the cooling block 6. The block 6 is fixed to a printed circuit board by the fixing spacer 3, the spring 4 is attached to the cooling block 6 by the two screws 24, 24 and tapped holes 6b provided in two portions in an upper face of the block 6, and is fixed to press an upper face of the heat transfer strut 2 downwards by spring pressure.
Bibliography:Application Number: JP19990150230