COPPER CLAD LAMINATE FOR PRINTED WIRING BOARD AND METHOD OF PRODUCING THE SAME

• Main Authors: IIJIMA TOSHIYUKI, TAKADA KOSUKE, MURAI AKIRA
• Format: Patent
• Language: English
• Published: 30.11.2000
• Edition: 7
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PERFORMING OPERATIONS; PRINTED CIRCUITS; TRANSPORTING

PROBLEM TO BE SOLVED: To obtain an efficient copper clad laminate for a printed wiring board by positioning aramid fiber threads on the four sides of a substrate, positioning copper foils on the both surfaces of the substrate, integrally laminating them by heating under pressure, and removing at least a portion of copper foils on the four sides by pulling out and striping off the aramid fiber threads. SOLUTION: Aramid fiber threads are positioned on the four sides of a substrate, copper foils are positioned on the both surfaces of the substrate, they are integrally laminated by heating under pressure, and at least a portion of the copper foils on the four sides are removed by pulling out and peeling off the aramid fiber threads. The aramid fiber threads are preferably positioned without interfering blank layout portions on the four sides of the substrate. Preferably for cutting off the buried aramid fiber threads, the aramid fiber threads are lengthened compared to the copper foils in advance, are positioned so as to protrude from the edges of the copper foils in laminated state, and are pulled out and peeled off along with the copper foils by pulling the protruded aramid fiber threads perpendicular to the surface of a copper clad laminate for a printed wiring board.