METHOD FOR TREATING SILICON WAFER

PROBLEM TO BE SOLVED: To avoid deterioration of working efficiency and working environment dnue to the mask for sandblast treatment by applying adhesive sheets with a specific pattern onto a silicon wafer and performing a sandblast treatment to the wafer with the adhesive sheets as a mask for machin...

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Bibliographic Details
Main Authors MIKI KAZUYUKI, YAMAMOTO MASAYUKI, NAMIKAWA AKIRA, AMETANI MINORU
Format Patent
LanguageEnglish
Published 30.11.2000
Edition7
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PROBLEM TO BE SOLVED: To avoid deterioration of working efficiency and working environment dnue to the mask for sandblast treatment by applying adhesive sheets with a specific pattern onto a silicon wafer and performing a sandblast treatment to the wafer with the adhesive sheets as a mask for machining into a prescribed pattern. SOLUTION: Adhesive sheets 5 with a prescribed pattern are applied onto a silicon wafer 1, that is fixed to a pedestal 3 by pressing the adhesive sheets 5 with a prescribed pattern that are provided at a mold release sheet 6 that is made of a plastic film or the like whose surface is coated with, for example, silicone and are supplied at a fixed speed onto the silicon wafer 1 for transferring using an application roller 7. The adhesive sheets 5 should have sufficient adhesion force for the silicon wafer 1, and various kinds of acryl and rubber adhesives are used.
Bibliography:Application Number: JP19990142438