DIGITAL HIGH FREQUENCY ANALOG HYBRID IC CHIP, IC PACKAGE AND DIGITAL HIGH FREQUENCY ANALOG HYBRID IC

• Main Authors: YAMAUCHI KAZUHISA, IKEDA YUKIO, NAKAYAMA MASATOSHI
• Format: Patent
• Language: English
• Published: 07.11.2000
• Edition: 7
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To reduce the size by grounding at least one I/O pad of a digital circuit provided between the I/O pads of high frequency signal I/O terminals adjacent to digital I/O terminals through a capacitor which can be considered to be short-circuited at high frequency and to be opened for a digital signal. SOLUTION: As a pin for isolating I/O pins 1a at a high frequency analog section, an I/O pin 1c for digital signal is provided at a position where a pin having only ground function is normally provided. It is grounded, on the outside of a package, through a capacitor 7 which can be considered as a sufficiently low impedance at a high frequency used in a high frequency analog and as a sufficiently high impedance at the frequency of a digital signal handled in a digital circuit. Consequently, a function for isolating the I/O pins 1a at the high frequency analog section can be provided without causing a damage on the function of the digital I/O pin 1c as the I/O pin of a digital circuit.