INSULATION COMPOSITION AND MULTILAYER WIRING PLATE

• Main Authors: FUKAI HIROYUKI, MORITA MASAKI, YAMADERA TAKASHI, TAKANEZAWA SHIN, HATAKEYAMA SHUICHI, IRINO TETSURO
• Format: Patent
• Language: English
• Published: 02.11.2000
• Edition: 7
• Subjects: BASIC ELECTRIC ELEMENTS; CABLES; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; CONDUCTORS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; INSULATORS; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PERFORMING OPERATIONS; PRINTED CIRCUITS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS

PROBLEM TO BE SOLVED: To provide an insulator with less deterioration in bonding strength between an insulating layer and a plated layer and insulating performance of the insulating layer under a high temperature and moisture by including photosensitive resin, alkylated melamine resin and aluminum hydroxide as essential components. SOLUTION: As alkylated melamine resin, methylated melamine resin, n- butylated melamine resin, and i-butylated melamine resin are listed. Independent use and combining use of two or more kinds are allowable. Degree of etherification of the alkylated melamine resin is not limited. As photosensitive resin, limitation does not exists, and use of compounds having a functional group capable of crosslinking directly by irradiation of light or under existence of a photo polymerization initiator by irradiation of light is allowable. From the standpoint for giving heat resistance to an insulating layer, compounds such as epoxy acrylate and phthalic acid modified epoxy acrylate are preferable.