SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To improve cooling performance by pressure fitting almost the entire substrate, mounted with a semiconductor chip, to a radiator plate. SOLUTION: A substrate 1 is formed into a curved shape protruding towards a radiator plate 18 side. A metal foil 2 is applied to the top surfac...

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Bibliographic Details
Main Author NAKASE YOSHIMI
Format Patent
LanguageEnglish
Published 24.10.2000
Edition7
Subjects
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
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Summary:PROBLEM TO BE SOLVED: To improve cooling performance by pressure fitting almost the entire substrate, mounted with a semiconductor chip, to a radiator plate. SOLUTION: A substrate 1 is formed into a curved shape protruding towards a radiator plate 18 side. A metal foil 2 is applied to the top surface of the substrate 1, and an IGBT chip and a flywheel diode are soldered onto the metal foil 2, and further a frame 6 is soldered thereonto. Both end parts of the substrate 1 are pressed against the radiator plate 18 with a plate spring 20 via the frame 6. At this time, since the substrate 1 is curved so that the radiator plate 18 side thereof protrudes, almost the entire substrate 1 become pressure fitted to the radiator plate 18. Thereby heat is excellently conducted satisfactorily from the substrate 1 to the radiator plate 18, for improved cooling performance.
Bibliography:Application Number: JP19990107998