RESIN MOLDING TOOL

PROBLEM TO BE SOLVED: To provide a resin molding tool for relaxing the thermal expansion difference so as to prevent the generation of cracks on a mold surface layer. SOLUTION: A mold surface layer 2 is constituted of three layers, and the thermal expansion coefficient of a second layer 10 as an int...

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Bibliographic Details
Main Authors YAMADA SATOSHI, WAKABAYASHI ITSUKI, NAKAJO KENICHI, HASHIMOTO HIROE, FURUYA TAMIO
Format Patent
LanguageEnglish
Published 17.10.2000
Edition7
Subjects
AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
PERFORMING OPERATIONS
SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR
SHAPING OR JOINING OF PLASTICS
TRANSPORTING
WORKING OF PLASTICS
WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Summary:PROBLEM TO BE SOLVED: To provide a resin molding tool for relaxing the thermal expansion difference so as to prevent the generation of cracks on a mold surface layer. SOLUTION: A mold surface layer 2 is constituted of three layers, and the thermal expansion coefficient of a second layer 10 as an intermediate layer is set smaller than the thermal expansion coefficient of a first layer 5 and larger than the thermal expansion coefficient of a third layer 15. The thermal expansion difference between the first layer 5 and the third layer 15 can be relaxed by the second layer 10 based on the arrangement, and for instance, the first layer 5 can be expanded comparatively freely without being restrained so much by the second layer 10.
Bibliography:Application Number: JP19990098838