WATER SOLUBLE FLUX AND METAL PASTE

PROBLEM TO BE SOLVED: To obtain a water soluble flux and a metal paste, having a stable viscosity from the start of use and having reduced dispersion of the transfer amount. SOLUTION: In a water soluble flux to be applied through transfer to the parts to be jointed before solder jointing and a metal...

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Bibliographic Details
Main Author SAKAI TADAHIKO
Format Patent
LanguageEnglish
Published 14.09.2000
Edition7
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CLADDING OR PLATING BY SOLDERING OR WELDING
CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MACHINE TOOLS
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
METAL-WORKING NOT OTHERWISE PROVIDED FOR
PERFORMING OPERATIONS
PRINTED CIRCUITS
SOLDERING OR UNSOLDERING
TRANSPORTING
WELDING
WORKING BY LASER BEAM
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Summary:PROBLEM TO BE SOLVED: To obtain a water soluble flux and a metal paste, having a stable viscosity from the start of use and having reduced dispersion of the transfer amount. SOLUTION: In a water soluble flux to be applied through transfer to the parts to be jointed before solder jointing and a metal paste which is the water soluble flux containing metal particles of solder, tin lead, silver, or copper, etc., the initial water content in weight % at the start of use, representing the water content contained in the flux from the first is set to not less than 1%. Thereby the viscosity of the flux can be stabilized from the initial state of the start of use at first, and the time required by a preliminary squeezing action needed hitherto for stabilizing the viscosity can be reduced, and the dispersion of the transfer amount can also be reduced.
Bibliography:Application Number: JP19990056508