MANUFACTURE OF MULTILAYER WIRING BOARD USING PHOTOSENSITIVE RESIN CONTAINING SPECIFIED POLYMERIZATION STABILIZER

PROBLEM TO BE SOLVED: To increase stability in storage of a resin film by causing photosensitive resin which will be an insulating layer of a multilayer wiring board to comprise a bismaleimide compound and an acridine compound as essentials, and to comprise another compound such as a hydrazine compo...

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Bibliographic Details
Main Authors FUKAI HIROYUKI, MORITA MASAKI, YAMADERA TAKASHI, TAKANEZAWA SHIN, HATAKEYAMA SHUICHI, IRINO TETSURO
Format Patent
LanguageEnglish
Published 08.09.2000
Edition7
Subjects
ADHESIVES
APPARATUS SPECIALLY ADAPTED THEREFOR
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CHEMICAL PAINT OR INK REMOVERS
CHEMISTRY
CINEMATOGRAPHY
COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS
CORRECTING FLUIDS
DYES
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
ELECTROGRAPHY
FILLING PASTES
HOLOGRAPHY
INKS
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
MATERIALS THEREFOR
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
ORIGINALS THEREFOR
PAINTS
PASTES OR SOLIDS FOR COLOURING OR PRINTING
PHOTOGRAPHY
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES
PHYSICS
POLISHES
PRINTED CIRCUITS
USE OF MATERIALS THEREFOR
WOODSTAINS
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Summary:PROBLEM TO BE SOLVED: To increase stability in storage of a resin film by causing photosensitive resin which will be an insulating layer of a multilayer wiring board to comprise a bismaleimide compound and an acridine compound as essentials, and to comprise another compound such as a hydrazine compound as a polymerization stabilizer. SOLUTION: A first circuit 2 is formed on an insulating substrate 1 made of glass fabric epoxy resin, paper phenol resin, or the like. On the insulating substrate 1 formed with the first circuit 2, an insulating layer 3 is formed. The insulating layer 3 is made of photosensitive resin comprising a bismaleimide compound and an acridine compound as essentials and comprising at least one compound out of a hydrazine compound, a polyhydroxy compound, a quinone compound, and an amino compound, as a polymerization stabilizer. By adding the polymerization stabilizer into the photosensitive resin, a film applied with the resin wherein an acridine compound and a bismareimide compound coexists has a good stability in storage.
Bibliography:Application Number: JP19990040755