PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR FORMATION OF PATTERN USING THE SAME

• Main Authors: EHANA TSUTOMU, OBA YOICHI, KUWABARA YOSUKE, IWASA SANDAI, TADACHI ATSUO, TSUKADA KENJIRO
• Format: Patent
• Language: English
• Published: 08.09.2000
• Edition: 7
• Subjects: APPARATUS SPECIALLY ADAPTED THEREFOR; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; CINEMATOGRAPHY; COMPOSITIONS BASED THEREON; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; ELECTROGRAPHY; HOLOGRAPHY; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; MATERIALS THEREFOR; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; ORIGINALS THEREFOR; PHOTOGRAPHY; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES; PHYSICS; PRINTED CIRCUITS; THEIR PREPARATION OR CHEMICAL WORKING-UP

PROBLEM TO BE SOLVED: To obtain a composition which can form a film having photoreactivity with high sensitivity and high resolution and good properties such as heat resistance against solder, electric insulating property and chemical resistance, and which is advantageous for environmental problems and hazards such as fire by neutralizing a carboxylic acid of an unsaturated group-containing polycarboxylic acid oligomer with a specified tertiary amine. SOLUTION: This photosensitive resin composition essentially consists of an unsaturated group-containing polycarboxylic acid oligomer, photosensitive monomer and photopolymerizable initiator, and the carboxylic acid of the unsaturated group-containing polycarboxylic acid oligomer is neutralized with a tertiary amine having an ethylenic unsaturated group in the molecule. Further, a thermosetting resin may be compounded in this composition. This invention also provides a method to form a solder resist pattern, and for example, this photosensitive resin composition is applied on a printed circuit board, temporarily dried, exposed to active rays into a pattern, developed with water or a diluted alkali solution to form a negative pattern, and further heat treated to form a solder resist.