MOUNTING TECHNIQUE FOR RESIN MOLDED SUBSTRATE

• Main Authors: UCHIYAMA HIROYUKI, NAKAJIMA TAKEO, KOBAYASHI NOBUYOSHI
• Format: Patent
• Language: English
• Published: 11.08.2000
• Edition: 7
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To provide the mounting technique for a resin molded substrate which can make the circuit board small-sized and lightweight. SOLUTION: When an electronic circuit is formed by mounting an electronic component on a resin molded substrate 1a having the surface of its wiring layer 3 covered with synthetic resin 2, a resin molded substrate 1a having an extended external electrode 6 formed by extending part of the wiring layer 3 to outside the external shape of the resin molded substrate 1a is manufactured and this extended external electrode 6 is folded to the side of the mount surface of the resin molded substrate 1a and connected to an electrode 15a of the electronic component 4c mounted on the resin molded substrate 1a. Or a conductor electrode is mounted on the mount surface of the resin molded substrate 1a while having one end connected to the wiring layer 3 and the other end of the conductor electrode is connected to the electrode of the electronic component mounted on the resin molded substrate 1a.