INSULATING SUBSTRATE WITH HIGH HEAT CONDUCTIVITY

PROBLEM TO BE SOLVED: To provide an insulating substrate which has large heat conductivity and excellent heat radiation characteristics. SOLUTION: This insulating substrate is constituted by joining a metal plate across a heat-conductive filler and a heat-conductive insulating layer made of an organ...

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Bibliographic Details
Main Authors SAWA HIROAKI, OTSUKA TETSUMI
Format Patent
LanguageEnglish
Published 11.08.2000
Edition7
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:PROBLEM TO BE SOLVED: To provide an insulating substrate which has large heat conductivity and excellent heat radiation characteristics. SOLUTION: This insulating substrate is constituted by joining a metal plate across a heat-conductive filler and a heat-conductive insulating layer made of an organic high polymer compound and the heat-conductive filler contains borate particles of magnesium and/or calcium covered with hexagonal boron nitride.
Bibliography:Application Number: JP19990027074