MANUFACTURE OF SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

• Main Author: NUMATA TORU
• Format: Patent
• Language: English
• Published: 11.08.2000
• Edition: 7
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To easily recognize the orientation of semiconductor devices which are made by resin-sealing a plurality of semiconductor elements as one collection and then cutting the resin-sealed body into pieces. SOLUTION: Semiconductor devices 1a, 1b have semiconductor elements (not shown) sealed with sealing resin and are provided on the surface with direction indicator marks 4 to show the orientation of the devices. A method for manufacturing the semiconductor devices 1a, 1b includes a process wherein a plurality of semiconductor elements are arranged in line in a cavity of a sealing mold (not shown) provided on its inner surface with a pattern for providing the direction indicator marks 4 on the surfaces of the semiconductor devices 1a, 1b, a process wherein sealing resin is supplied into the inside of the sealing mold to resin-seal the semiconductor elements at a time to fabricate a collection 2 of a plurality of the semiconductor devices 1a, 1b, and a process wherein the collection 2 is cut at specified cut positions 3 into a plurality of the individual semiconductor devices 1a, 1b.