MANUFACTURE OF MULTILAYER PRINTED-WIRING BOARD

PROBLEM TO BE SOLVED: To provide a manufacturing method for a multilayer printed-wiring board whose molding defect can be reduced. SOLUTION: A resin varnish 2 is arranged on the surface of every core board 3 comprising a circuit. The resin varnish which is arranged on the surface of every core board...

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Bibliographic Details
Main Author NAKAGAWA TERUO
Format Patent
LanguageEnglish
Published 04.08.2000
Edition7
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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