MANUFACTURE OF MULTILAYER PRINTED-WIRING BOARD

PROBLEM TO BE SOLVED: To provide a manufacturing method for a multilayer printed-wiring board whose molding defect can be reduced. SOLUTION: A resin varnish 2 is arranged on the surface of every core board 3 comprising a circuit. The resin varnish which is arranged on the surface of every core board...

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Bibliographic Details
Main Author NAKAGAWA TERUO
Format Patent
LanguageEnglish
Published 04.08.2000
Edition7
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:PROBLEM TO BE SOLVED: To provide a manufacturing method for a multilayer printed-wiring board whose molding defect can be reduced. SOLUTION: A resin varnish 2 is arranged on the surface of every core board 3 comprising a circuit. The resin varnish which is arranged on the surface of every core board 3 is set to a semihardened state. After that, a plurality of core boards 3 are fed between a pair of long metal foils 2, and a plurality of combined materials 4 are formed. The combined materials 4 are heated and pressurized, and the metal foils 1 and the core boards 3 in the combined materials 4 are integrated. The metal foils 1 are cut between the adjacent combined materials 4. The combined materials 4 in which the metal foils 1 and the core boards 3 are integrated are divided. Cut scraps which are generated at a time when the metal foils 1 between the adjacent combined materials 4 are cut hardly creep between the resin varnishes 2 and the core boards 3.
Bibliography:Application Number: JP19990017061