MANUFACTURE OF MULTILAYER PRINTED-WIRING BOARD

• Main Author: NAKAGAWA TERUO
• Format: Patent
• Language: English
• Published: 04.08.2000
• Edition: 7
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

PROBLEM TO BE SOLVED: To provide a manufacturing method for a multilayer printed-wiring board whose molding defect can be reduced. SOLUTION: A resin varnish 2 is arranged on the surface of every core board 3 comprising a circuit. The resin varnish which is arranged on the surface of every core board 3 is set to a semihardened state. After that, a plurality of core boards 3 are fed between a pair of long metal foils 2, and a plurality of combined materials 4 are formed. The combined materials 4 are heated and pressurized, and the metal foils 1 and the core boards 3 in the combined materials 4 are integrated. The metal foils 1 are cut between the adjacent combined materials 4. The combined materials 4 in which the metal foils 1 and the core boards 3 are integrated are divided. Cut scraps which are generated at a time when the metal foils 1 between the adjacent combined materials 4 are cut hardly creep between the resin varnishes 2 and the core boards 3.