RESIN MODIFIER, RESIN COMPOSITION, AND SEAMLESS BELT FOR IMAGE FORMER

• Main Authors: NISHIKAWA MANABU, SAKOGAWA KOUICHI, MORI KOUYA, TOKI SATOSHI, WATANABE AKIRA
• Format: Patent
• Language: English
• Published: 25.07.2000
• Edition: 7
• Subjects: AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; CHEMISTRY; CINEMATOGRAPHY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; ELECTROGRAPHY; ELECTROPHOTOGRAPHY; GENERAL PROCESSES OF COMPOUNDING; HOLOGRAPHY; MAGNETOGRAPHY; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PHOTOGRAPHY; PHYSICS; THEIR PREPARATION OR CHEMICAL WORKING-UP; WORKING-UP

PROBLEM TO BE SOLVED: To obtain a resin modifier for resin composition which can give a seamless belt showing stable resistance for a long time and improved wide usability by making the resin modifier contain a specified copolymer and an epoxy-containing compound. SOLUTION: This modifier comprises 99-20 wt.% copolymer comprising structural units of formulae I, II or III, and IV in such amounts that the molar ratio among structural units of formulae I to IV is (10-50):(30-70):(15-50), where the total of formula I, formula II or III, and formula IV is 100 and having a weight-average molecular weight of 1,000-50,000 and 1-80 wt.% epoxy- containing compound having an epoxy equivalent of 1,000-100,000 g/equivalent. In the formulae, R1 to R4 are each H or a 1-100C alkyl optionally modified with an arbitrary functional group, provided that R3 and R4 may be combined with each other to form a cyclic ester group; R5 is a 0-10C alkylene; R6 is a 1-10C alkyl; R7 is H, hydroxyl, or a 1-20C alkoxy optionally modified with an arbitrary functional group; R8 is H or an alkyl optionally modified with an arbitrary functional group; and (n) is 1-50.