LAMINATED POLYAMIDE FILM

PROBLEM TO BE SOLVED: To provide a laminated polyamide film excellent in dimensional stabil ity at the moisture absorption, good in pinhole resistance and curl resistance, provided with high gas barrier properties by the vapor deposition of inorg. oxide, hard to generate a crack in an inorg. vapor d...

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Main Authors IWANISHI MASUMI, FUJITA SHINJI, MORISHIGE CHIKAO, SUGIMOTO MASANORI, YONEDA SHIGERU
Format Patent
LanguageEnglish
Published 25.07.2000
Edition7
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Summary:PROBLEM TO BE SOLVED: To provide a laminated polyamide film excellent in dimensional stabil ity at the moisture absorption, good in pinhole resistance and curl resistance, provided with high gas barrier properties by the vapor deposition of inorg. oxide, hard to generate a crack in an inorg. vapor deposition film and keeping gas barrier properties even if subjected to sterilizing treatment using hot water. SOLUTION: A laminated polyamide film has both surface layers comprising a compsn. consisting of 20-80 wt.% of metaxyleneadipamide (A) and 80-20 wt.% of nylon 6 (B) in a phase separated state. An intermediate layer comprising a resin having a compsn. consisting of 0-15 wt.% of the resin (A) and 100-85 wt.% of the resin (B) is formed between both surface layers.
Bibliography:Application Number: JP19990008466