SILVER AND SILVER ALLOY PLATING BATH

PROBLEM TO BE SOLVED: To provide a stable silver or silver alloy plating bath of non-cyan type. SOLUTION: This bath contains (A) a soluble salt between a silver salt and a mixture of a silver salt and the salt of such a metal as tin, bismuth, indium and lead and (B) an aliphatic sulfide such as thio...

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Bibliographic Details
Main Authors TAKEUCHI TAKAO, NAWAFUNE HIDEMI, TSUJI SEIKI, NISHIKAWA TETSUJI, OBATA KEIGO
Format Patent
LanguageEnglish
Published 11.07.2000
Edition7
Subjects
APPARATUS THEREFOR
CHEMISTRY
ELECTROFORMING
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES
METALLURGY
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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Summary:PROBLEM TO BE SOLVED: To provide a stable silver or silver alloy plating bath of non-cyan type. SOLUTION: This bath contains (A) a soluble salt between a silver salt and a mixture of a silver salt and the salt of such a metal as tin, bismuth, indium and lead and (B) an aliphatic sulfide such as thiobis(diethylene glycol), dithiobis(triglycerol), 3,3'-thiodipropanaol and thiodiglycerin contg. >=1 etheric oxygen atom, 1-hydroxypropyl group or hydroxypropylene group and not contg. basic nitrogen atom. The stability of the bath on ageing, coprecipitation of silver and various metals, appearance of the electrodepositing film, etc., are improved as compared with a bath contg. the thiodiglyceric acid and β-dithiodiglycol as the aliphatic monosulfide compds. not contg. etheric oxygen, 1-hydroxypropyl group nor hydroxypropylene group.
Bibliography:Application Number: JP19980366192