THERMOPLASTIC RESIN COMPOSITION, HEAT-SENSITIVE TACKY SHEET AND PRODUCTION OF HEAT-SENSITIVE TACKY SHEET

• Main Authors: TAKAHASHI IKUO, MIZUMOTO SEIJI
• Format: Patent
• Language: English
• Published: 11.07.2000
• Edition: 7
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; DYES; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ORGANIC MACROMOLECULAR COMPOUNDS; PAINTS; POLISHES; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS; USE OF MATERIALS AS ADHESIVES

PROBLEM TO BE SOLVED: To obtain the subject composition capable of raising a temperature to cause plasticization of a thermoplastic resin, developing sufficient tackiness at a temperature to stick a label and maintaining high adhesiveness and transparency for a long period of time by using both a thermoplastic resin and specific plural solid plasticizers. SOLUTION: This composition comprises (A) a thermoplastic resin and (B) a solid plasticizer composed of (i) a phosphorus compound having 55-100 deg.C melting point and (ii) at least one compound selected from a dioxybenzene derivative and dicyclohexyl phthalate. A compound of the formula (R1 to R4 are each a hydrocarbon or a heterocyclic group; A is a bifunctional hydrocarbon or heterocyclic group; k is 0 or 1; m is 0-3), etc., are preferable as the component i. The dioxybenzene derivative of the component ii is preferably a diester compound of hydroquinone, etc., and an organic monobasic acid. The content of the component B is preferably 30-1,000 pts.wt. based on 100 pts.wt. of the component A.