SEMICONDUCTOR DEVICE, MANUFACTURE THEREOF AND REINFORCING TAPE USED FOR MANUFACTURING THE SAME

PROBLEM TO BE SOLVED: To provide a tape usable when being bent and easy to handle in manufacturing. SOLUTION: A tape carrier of this device comprises a thin insulation tape which is formed like a band and has specified wiring patterns 5 laid thereon, IC chips 4 which are mounted with fixed spacings...

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Bibliographic Details
Main Author NAKAMURA CHIYUUEI
Format Patent
LanguageEnglish
Published 23.06.2000
Edition7
Subjects
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
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Summary:PROBLEM TO BE SOLVED: To provide a tape usable when being bent and easy to handle in manufacturing. SOLUTION: A tape carrier of this device comprises a thin insulation tape which is formed like a band and has specified wiring patterns 5 laid thereon, IC chips 4 which are mounted with fixed spacings in the lengthwise direction on the insulation tape 2 and electrically connected to the wiring patterns 5, and reinforcing thick tapes 3 which are disposed along the length on both sides of the insulation tape 2 and have carrying sprocket holes 7.
Bibliography:Application Number: JP19980342105