ELEMENT MOUNTING METHOD AND SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide the mounting method of an element and a low cost and high insulating reliability semiconductor device having low conductive resistance and no connection defect. SOLUTION: This element mounting method is composed of the first step wherein a wafer having an adhered ins...

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Bibliographic Details
Main Author MURAKAMI ASAO
Format Patent
LanguageEnglish
Published 30.05.2000
Edition7
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PROBLEM TO BE SOLVED: To provide the mounting method of an element and a low cost and high insulating reliability semiconductor device having low conductive resistance and no connection defect. SOLUTION: This element mounting method is composed of the first step wherein a wafer having an adhered insulating resin film 3 is temporariry heated up in a vacuum state, the second step wherein photosensitive resist is laminated to the insulating resin film 3 on the wafer formed by the first step, the third step wherein the prescribed-shaped hole is formed on the photosensitive resist on an electrode pad 2, the fourth step wherein conductive resin 6 is filled in the hole provided by the third step, the fifth step wherein the conductive resin 6 formed by the fourth step is temporarily cured, and the sixth step wherein the photosensitive resist formed on and after the third step is stripped and the conductive resin electrode, formed containing conductive resin 6, is formed on the electrode pad.
Bibliography:Application Number: JP19980327548