SEMICONDUCTOR DEVICE AND ITS MANUFACTURE

• Main Authors: HORIUCHI MICHIO, IMAI KAZUNARI
• Format: Patent
• Language: English
• Published: 16.05.2000
• Edition: 7
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To provide a semiconductor device, which can easily cope with the needs for miniaturization and the like of a semiconductor element. SOLUTION: This semiconductor device is constituted into a structure, wherein lands 20 for connection formed on the electrode terminal formation surface of a semiconductor element 10 and pads 22 for connection, which are arranged facing opposite the lands 20 and are formed on the side of the surface on one side of the surfaces of a connected substrate 12 consisting of an insulative base material, are electrically connected with each other via connecting bumps 14, with wiring patterns 24 comprising each pad 20 for connection formed on the side of the surface on one side of the surfaces of the substrate 12, wiring patterns 30, which are respectively mounted with each terminal 26 for external connection and respectively contain each land 28 for terminal, are formed on the side of the other surface of the substrate 12, and the patterns 24 formed on the side of the surface on one side of the surfaces of the substrate 12 and the patterns 30 formed on the other surface of the substrate 12 are electrically connected with each other within recessed parts formed penetrating the insulative base material of the substrate 12 and through which the rear surfaces, which are positioned on the side of the insulative base material of the patterns 24, are exposed on the bottoms of the recessed parts, via vias 32 formed by filling a metal film in the recessed parts through plating.