SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide a semiconductor device in which semiconductor chips are mounted on both faces, which can be provided with high integration and multifuctionality, which can be made thin and whose damage-resistant property and mounting property are good. SOLUTION: Semiconductor chips...

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Bibliographic Details
Main Author NOKITA KANTA
Format Patent
LanguageEnglish
Published 28.04.2000
Edition7
Subjects
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