SEMICONDUCTOR DEVICE
PROBLEM TO BE SOLVED: To provide a semiconductor device in which semiconductor chips are mounted on both faces, which can be provided with high integration and multifuctionality, which can be made thin and whose damage-resistant property and mounting property are good. SOLUTION: Semiconductor chips...
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Main Author | |
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Format | Patent |
Language | English |
Published |
28.04.2000
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Edition | 7 |
Subjects | |
Online Access | Get full text |
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