SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide a semiconductor device in which semiconductor chips are mounted on both faces, which can be provided with high integration and multifuctionality, which can be made thin and whose damage-resistant property and mounting property are good. SOLUTION: Semiconductor chips...

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Bibliographic Details
Main Author NOKITA KANTA
Format Patent
LanguageEnglish
Published 28.04.2000
Edition7
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PROBLEM TO BE SOLVED: To provide a semiconductor device in which semiconductor chips are mounted on both faces, which can be provided with high integration and multifuctionality, which can be made thin and whose damage-resistant property and mounting property are good. SOLUTION: Semiconductor chips 5 are mounted on a pad 1 whose thickness is made thin from both face sides in such a way that they creep into thin places. The semiconductor chips 5 and leads 2 which are installed around the pad 1 are connected by metal wires 7, Lead parts which includes connected places of the metal wires 7, the pad 1 and the semiconductor chips 5 are sealed with a resin 8. Thereby, this semiconductor device is constituted. In addition, depths which are formed by making the thickness of the pad 1 thin are made equal to or more than the semiconductor chips 5. Rear surfaces of the leads 2 which are derived from parts which are sealed with the resin 8 are situated to be equal to the resin-sealed rear surface or to be a little lower.
Bibliography:Application Number: JP19980313959