METHOD AND DEVICE FOR DETECTING WAFER POSITION

PROBLEM TO BE SOLVED: To provide a wafer position detecting method which is simple and allows detection with high accuracy. SOLUTION: Intersections of perpendicular bisectors 13 and 14 of line segments connecting sampling points representing a profile of wafer's edge are acquired, and the mean...

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Bibliographic Details
Main Authors NAGASAKI TATSUO, HATTORI TORU, FUKUI YUKO
Format Patent
LanguageEnglish
Published 21.04.2000
Edition7
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PROBLEM TO BE SOLVED: To provide a wafer position detecting method which is simple and allows detection with high accuracy. SOLUTION: Intersections of perpendicular bisectors 13 and 14 of line segments connecting sampling points representing a profile of wafer's edge are acquired, and the mean value of them is taken to calculate a temporary center point Q2 of a wafer W. First a point P4 nearest from wafer's temporary center point Q2 is extracted, and a point which is equidistant from sampling points comprising it except for specified points on the left and light is acquired. This point becomes a true center point Q3 of the wafer W.
Bibliography:Application Number: JP19980287063