SCANNING ALIGNER

PROBLEM TO BE SOLVED: To improve the detected accuracy of a stage position in a scanning aligner. SOLUTION: A laser beam 103L taken out from an ArF excimer laser 103 of the exposure light source of a scanning aligner 100 is guided through the inside of an aligner main body 101, and is projected on a...

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Bibliographic Details
Main Authors TASHIRO TAKESHI, MACHIDA TAKAHIRO, KATO TAKESHI, KUROIWA KEIZO, TATEGAMI ATSUSHI, TAKEHISA KIWAMU
Format Patent
LanguageEnglish
Published 31.03.2000
Edition7
Subjects
APPARATUS SPECIALLY ADAPTED THEREFOR
BASIC ELECTRIC ELEMENTS
CINEMATOGRAPHY
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
ELECTROGRAPHY
HOLOGRAPHY
MATERIALS THEREFOR
ORIGINALS THEREFOR
PHOTOGRAPHY
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES
PHYSICS
SEMICONDUCTOR DEVICES
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Summary:PROBLEM TO BE SOLVED: To improve the detected accuracy of a stage position in a scanning aligner. SOLUTION: A laser beam 103L taken out from an ArF excimer laser 103 of the exposure light source of a scanning aligner 100 is guided through the inside of an aligner main body 101, and is projected on a reticle 115 to expose a wafer 120d in the form of a pattern through a reducing projection lens 117 to the outgoing laser beam through the reticle 115. Since the inside of the aligner main body 101 is filled with helium gas, the length wise measurement error in sensing the position of a wafer stage 118 by a HeNe laser 140 can be reduced.
Bibliography:Application Number: JP19980259686