SEMICONDUCTOR ELEMENT, BONDING OF DIE OF SEMICONDUCTOR ELEMENT AND DEVICE

• Main Authors: NAN JIHAKU, KIM DONG-KUK
• Format: Patent
• Language: English
• Published: 14.03.2000
• Edition: 7
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; SEMICONDUCTOR DEVICES; TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION; TECHNICAL SUBJECTS COVERED BY FORMER USPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ARTCOLLECTIONS [XRACs] AND DIGESTS

PROBLEM TO BE SOLVED: To provide a semiconductor element, which can improve the insulation properties and reliability of the element by bonding dies on a substrate using electrically insulative tapes and at the same time, decrease the production cost of the element. SOLUTION: When a substrate bonded with first dies 64 with a conductive bonding agent is fed, an insulating adhesive tape 68 is wound out from a reel 44 and is cut in a prescribed size. A tape pickup means 52 bonds the cut insulating adhesive tapes 68 on the substrate and a die pickup means 54 bonds second dies 72 on the tapes 68 on the substrate. The tapes 68 have a dielectric strength of about 2500 V or higher. A stage for bonding the tapes 68 on the substrate and a stage for bonding the dies 64 on the substrate are executed with a heat of about 150 to about 500 deg.C and at a pressure of about 100 to about 600 gf/mm2.