SEMICONDUCTOR ELEMENT, BONDING OF DIE OF SEMICONDUCTOR ELEMENT AND DEVICE
PROBLEM TO BE SOLVED: To provide a semiconductor element, which can improve the insulation properties and reliability of the element by bonding dies on a substrate using electrically insulative tapes and at the same time, decrease the production cost of the element. SOLUTION: When a substrate bonded...
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Main Authors | , |
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Format | Patent |
Language | English |
Published |
14.03.2000
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Edition | 7 |
Subjects | |
Online Access | Get full text |
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Summary: | PROBLEM TO BE SOLVED: To provide a semiconductor element, which can improve the insulation properties and reliability of the element by bonding dies on a substrate using electrically insulative tapes and at the same time, decrease the production cost of the element. SOLUTION: When a substrate bonded with first dies 64 with a conductive bonding agent is fed, an insulating adhesive tape 68 is wound out from a reel 44 and is cut in a prescribed size. A tape pickup means 52 bonds the cut insulating adhesive tapes 68 on the substrate and a die pickup means 54 bonds second dies 72 on the tapes 68 on the substrate. The tapes 68 have a dielectric strength of about 2500 V or higher. A stage for bonding the tapes 68 on the substrate and a stage for bonding the dies 64 on the substrate are executed with a heat of about 150 to about 500 deg.C and at a pressure of about 100 to about 600 gf/mm2. |
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Bibliography: | Application Number: JP19990206148 |