METHOD FOR INSPECTING FILLED STATE OF CONDUCTIVE PASTE OF VIA HOLE

PROBLEM TO BE SOLVED: To speedily and accurately obtain the amount of filling of a conductive paste in a via hole, internal foreign objects, and the like. SOLUTION: A substrate 11 where a conductive paste is filled into a via hole 12 is irradiated with an X ray from an X-ray source 13, and the amoun...

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Bibliographic Details
Main Authors NAGASAKI TATSUO, NOMURA TAKESHI, KUBO HIROYASU
Format Patent
LanguageEnglish
Published 25.02.2000
Edition7
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
MEASURING
PHYSICS
PRINTED CIRCUITS
TESTING
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Summary:PROBLEM TO BE SOLVED: To speedily and accurately obtain the amount of filling of a conductive paste in a via hole, internal foreign objects, and the like. SOLUTION: A substrate 11 where a conductive paste is filled into a via hole 12 is irradiated with an X ray from an X-ray source 13, and the amount of transmitted X rays is measured, thus detecting the amount of filling of the paste and the presence or absence of an internal included foreign object that differs from the material of the paste. In that case, there is difference between the amount of X-ray absorption when the filled state of the paste is normal and the amount of X-ray absorption when the foreign object exists inside, thus judging whether the filled state is conforming or not based on it.
Bibliography:Application Number: JP19980225073