METHOD FOR DISTRIBUTING CHIP WITH SOLDER BUMP ON FRONT SURFACE USING TAPE FOR CARRYING CHIP

• Main Authors: GUTENTAG CHARLES, DUDDERAR THOMAS D
• Format: Patent
• Language: English
• Published: 08.02.2000
• Edition: 7
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES; TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION; TECHNICAL SUBJECTS COVERED BY FORMER USPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS

PROBLEM TO BE SOLVED: To provide a method for mounting a flip chip speedily suited for a flip flop bonding by taking out an IC chip. SOLUTION: A tape system for transportation for a flip-chip assembly device is configured so that a chip 14 is taken out of the reverse side of a tape 13 for transportation. In this case an evacuation head 21 of a take-out device 16 touches the reverse side of the IC chip 14, a die take-out pin 17 pushes up the IC chip 14 and takes it out with the circuit side (where a solder bump is located) of the chip 14 facing downward.