SENSOR STRUCTURE AND METHOD OF MUTUALLY CONNECTING SEPARATED STRUCTURES

• Main Authors: GER MUH-LING, FOERSTNER JUERGEN A, LI GUANG X, SHEMANSKY JR FRANK A, SCHMIESING JOHN E, ZHANG Z LISA, BERGSTROM PAUL L
• Format: Patent
• Language: English
• Published: 28.01.2000
• Edition: 7
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT; MEASURING; MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION,OR SHOCK; PHYSICS; SEMICONDUCTOR DEVICES; TESTING

PROBLEM TO BE SOLVED: To provide a sensor structure which permits required electric separation and connection without forming an oxide separation layer. SOLUTION: For a sensor 10, a bridge is built over an open trench 22, using conductive bridges 30-34, and electric connection is given between structures 24, 26 within an integrated circuit. The conductive bridge is useful in a sensor where the measurement of electric properties such as the capacity difference between the structures separated electrically. By forming an open trench around the flank, the structure is electrically separated. The bottom of the structure is electrically separated by an oxide layer. To form a conductive bridge, at first, the trench is filled with sacrificed glass to make firm foundation, and thereon a polysilicon conductor is arranged, and next the sacrificed glass is removed, and a conductive bride is made on the open trench. The open trench gives required separation, and the conductive bridge gives required electric connection.