BACKING FOR LAMINATED PLATE OF HIGH THERMAL CONDUCTIVITY

• Main Authors: TOYOSHIMA SETSUO, SHINOZUKA HIROSHI
• Format: Patent
• Language: English
• Published: 07.01.2000
• Edition: 7
• Subjects: INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS; MAKING GRANULES OR PREFORMS; PERFORMING OPERATIONS; PREPARATION OR PRETREATMENT OF THE MATERIAL TO BESHAPED; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIALCONTAINING PLASTICS; TRANSPORTING; WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

PROBLEM TO BE SOLVED: To be thin, low in porosity, good in insulation and thermal conductivity properties, and light in weight by using a substance of high thermal conductivity, a heat resistant polymer material, and a binder material as main constituting materials and making a nonwoven fabric sheet having a thermally conductive membrane substance formed from an inorganic coating membrane forming substance on the surface of each constituting material. SOLUTION: A substance of high thermal conductivity, a heat resistant polymer material, a binder material are used as main constituting materials, and a nonwoven fabric including a thermally conductive membrane substance formed from an inorganic coating membrane forming substance on the surface of each constituting material is made. Aluminum nitride, beryllia, aluminumized nickel, silicon carbide, and others are as the substance of high thermal conductivity, and the thermal conductivity is made at least 10 W/m K. The heat resistant temperature of the heat resistant polymer material including fluorine type, silicone type, aromatic heterocyclic type polymer materials is made at least 260 deg.C. A metal alcoxide, a metal acetyl acetonate, a metal organic acid salt, and others are used as the inorganic coating membrane forming substance.