BAGNO ELETTROLITICO E PROCEDIMENTO PER PALLADIO BIANCO

The present invention relates to an improved metallic additive free palladium electroplating bath comprising the use of a sulfonic acid compound in combination with a special class of pyridine related nitrogen compounds to both stabilize the bath and to provide white palladium deposits over a wide r...

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Bibliographic Details
Main Authors TOO ELENA, PANECCASIO VINCENT, JR
Format Patent
LanguageItalian
Published 12.08.1994
Subjects
APPARATUS THEREFOR
CHEMISTRY
ELECTROFORMING
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES
HETEROCYCLIC COMPOUNDS
METALLURGY
ORGANIC CHEMISTRY
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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Summary:The present invention relates to an improved metallic additive free palladium electroplating bath comprising the use of a sulfonic acid compound in combination with a special class of pyridine related nitrogen compounds to both stabilize the bath and to provide white palladium deposits over a wide range of plating thicknesses.
Bibliography:Application Number: IT1994TO00660