GRUPPO COSTRUTTIVO PER APPARECCHI DI COMANDO ELETTRICI

The module has at least one electronic power component (11) mounted on an electronic control circuit board (10) so that it lies in contact with the inside face (34) of one of the outer sidewalls of the housing (30) of the control device, acting as a heat sink for dissipating the waste heat generated...

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Bibliographic Details
Main Authors BENTZ WILLY, WALDEMAR ERNST
Format Patent
LanguageItalian
Published 14.09.1993
Edition5
Subjects
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
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Summary:The module has at least one electronic power component (11) mounted on an electronic control circuit board (10) so that it lies in contact with the inside face (34) of one of the outer sidewalls of the housing (30) of the control device, acting as a heat sink for dissipating the waste heat generated by the power component. The power component is mounted on the circuit board via a fixing element (12). A spring (27) is used to press the power component into firm contact with the housing sidewall. ADVANTAGE - Rapid, good heat dissipation without requiring additional cooling elements. Can be built into housing of control unit. Power components can be plugged in by hand or automatically from above in simple manner during mounting.
Bibliography:Application Number: IT1993MI01982