PROCEDIMENTO DI FABBRICAZIONE DI UN DISPOSITIVO COMPRENDENTE DUE PIASTRINE SEMICONDUTTRICI E DISPOSITIVO COSI' OTTENUTO

Device formed by a first die (210) and a second die (221). The first die is of semiconductor and integrates electronic components (202). The second die has a main surface (210A), forms patterned structures (230) and is bonded to the first die. Internal electrical coupling structures (242) electrical...

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Bibliographic Details
Main Authors GARAVAGLIA, MATTEO, SHAW, MARK ANDREW, CORSO, LORENZO, ALLEGATO, GIORGIO
Format Patent
LanguageItalian
Published 01.05.2024
Subjects
MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES
MICROSTRUCTURAL TECHNOLOGY
PERFORMING OPERATIONS
TRANSPORTING
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Summary:Device formed by a first die (210) and a second die (221). The first die is of semiconductor and integrates electronic components (202). The second die has a main surface (210A), forms patterned structures (230) and is bonded to the first die. Internal electrical coupling structures (242) electrically couple the main surface (210A) of the first die (210) to the second die (221). External connection regions (241) extend on the main surface of the first die (210). A package (246) embeds the first die (210), the second die (221) and the internal electrical coupling structures (242) and partially surrounds the external connection regions (241), the external connection regions partially protruding from the package. The second die (221) has through recesses (207, 208) accommodating external connection regions
Bibliography:Application Number: IT20220022395